PCB Fabrication and Assembly Services

Custom PCB cost is driven by board size, layer count, material, quantity, trace and spacing requirements, drilling, finishes, impedance control, and any special features such as blind vias. Assembly pricing also reflects component availability, placement count, package type, testing, and packaging needs. Cir-Q-Tek prepares quotes from a Gerber package or ODB file and bill of materials, allowing the build requirements to be evaluated accurately.

A custom PCB is a printed circuit board designed and manufactured for a specific electronic product rather than purchased as a standard, off-the-shelf board. Its layout, dimensions, layer stackup, copper features, hole sizes, finishes, and electrical requirements are tailored to the application. Custom boards may support anything from a simple single-sided circuit to a high-density multilayer design with controlled impedance and specialized vias.

For PCB fabrication or assembly, Cir-Q-Tek requests a Gerber package or ODB file and a bill of materials. These files identify the board’s physical construction, circuitry, drill information, required materials, finishes, and components. Supplying complete, current documentation helps the team assess manufacturability, source parts, select efficient manufacturing practices, and provide a quote aligned with the project’s technical requirements.

Pre-production and prototype samples generally take about three days to build and two days to ship. Production manufacturing orders are typically ready to ship in approximately 10 days to four weeks. Actual timing depends on board complexity, fabrication features, material availability, component sourcing, assembly requirements, testing, and order quantity. Providing complete design data early helps prevent avoidable delays in the quote and manufacturing process.

Yes. Cir-Q-Tek supports quick-turn prototype orders, small-batch builds, and production manufacturing quantities. The company states that it has not turned down PCB orders based on quantity. This flexibility lets product teams validate a design with smaller runs before scaling into production, while keeping fabrication, component procurement, and assembly coordination with the same manufacturing partner.

Cir-Q-Tek supports single-sided, double-sided, multilayer, rigid, and flexible PCBs. Capabilities include multilayers up to 40 layers, blind and buried vias, impedance control, laser-drilled holes down to .0039 inches, and line and spacing down to .0025/.0025 inches. Available metallic finishes include HASL, lead-free HAL, ENIG, immersion silver, immersion tin, and OSP. RoHS-compliant bare boards are also available.

Each SMT line is equipped with automated optical inspection and X-ray equipment for inline quality verification. These inspection capabilities are particularly valuable for dense assemblies and component packages where visual access is limited, including BGA devices. Cir-Q-Tek also supports testing as part of its turnkey assembly offering. The appropriate inspection and test approach should be defined around the board design, components, and application requirements.

Yes. Cir-Q-Tek’s procurement team can help source obsolete or hard-to-get parts and evaluate equivalent components for assembly programs. Component availability should be reviewed early because lead times, lifecycle status, approved alternates, and pricing can affect the final build schedule. Sharing a current bill of materials and any manufacturer or approval restrictions enables a more focused sourcing review and reduces procurement risk.